Displacement Deposition Behavior of Copper via Oxidative Dissolution of TiN Thin Film.
نویسندگان
چکیده
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ژورنال
عنوان ژورنال: Journal of the Surface Finishing Society of Japan
سال: 2001
ISSN: 0915-1869,1884-3409
DOI: 10.4139/sfj.52.773